Shenzhen PEAK Technology Co., Ltd

Up to 64 Layers FR4 TG135/TG150/TG170 Halogen Free/CTI≥600 Aspect Ratio (Finish Hole) 28:1 Sample Expedited 8 Hours(1-2Layer) Blind/Buried Via 5+N(N+M)+5 Structure Trace Width/Spacing 1.6/1.6mil Laser Hole Size(mm)≥0.075 High Density Interconnector More than 85+ Types Rogers/Arlon/Taconic/Isola/ Nelco/F4B Serices,etc Materials can be Specified Impedance Tolerance ±5%(min) Panasonic Megtron4/6/7 TU-872SLK/Isola-FR408HR,etc Impedance Tolerance ±5%(min) Dimension Accuracy ±0.02mm(min) Line Width/Space Accuracy ±5% Thermal Conductivity 1-398W/m.K Aluminum/Copper AC 500-4000V Post-bonding/Pre-bonding Sweat-Soldering/Conductive Adhesive Press-Fit/Embedded Coin(I, T U) 2-24 Layers Book/Air-gap/Fly-tail Unsymmetrical/Semi-Flex Width of Flexible Zone 3mm(min) Dimension Accuracy ±0.05mm(min) CSP/FC-CSP/SIP/FC-BGA/WB-CSP FR4/BT/High-Speed Material Trace Width/Space 12/12μm SM Registration:±20μm Strict SM Flatness Control ≤5μm Ceramic/Glass Material Hybrid Material Lamination Buried Capacitance/Resistance PTH/NPTH Step Slots Uneven/Segmented/Step Gold Finger Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities.PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM's in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.