Hebei Ruisite Precision Technology Co., Ltd

Gold plating has low contact resistance, good electrical conductivity, good weldability, corrosion resistance, so electroplating has a wide range of applications in integrated circuit manufacturing, for example: in the driver IC package commonly used electroplated gold bump; in CMOS/MEMS in the application of electroplating to make switch contacts and various structures, etc.; In the radar gold plating as an air bridge is applied; plating is also used for UBM barrier layer protection layer, and for a variety of lead bonding bonding surface and so on.
PCB plating machine line Hebei Ruisite
Model No.: RST-BDT-001
Price: US$6,000-US$200,000
Min. order quantity: 1 Set
Capacity: 5 Sets / Month
Country of origin: Hebei,China
Trade terms: FOB, CFR, CIF
Payment terms: L/C, T/T